Refereed Journals

2018

• In situ measurement of the effect of stress on the chemical diffusion coefficient of Li in high-energy-density electrdoes, Vol. 165 (10), A2194-A2202, 2018, Journal of The Electrochemical Society. (Co-authors: R Tripuraneni and S Rakshit)
• Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints, Vol. 199, 730-738, 2018, Engineering Fracture Mechanics. (Co-authors: PB Thompson and R Johnson)
• Intelayer adhesion and fracture resistance of polymers printed through melt extrusion additive manufacturing process, Vol. 156, 351-361, 2018, Materials & Design. (Co-authors: N Aliheidari, J Christ, R Tripuraneni, and A Ameli)
  

• Realtime-stress measurement in SiO2 thin films during electrochemical lithiation/delithiation cycling, Vol. 54 (4), 537-547, 2018, Experimental Mechanics. (Co-authors: Rakshit Subhajit and Tripuraneni Rajasekhar)

2017

• Fracture resistance measurement of fused deposition modeling 3D printed polymers, Vol.60, 94-101, 2017, Polymer Testing. (Co-authors:Nahal Aliheidari, Rajasekhar Tripuraneni, and Amir Ameli)

2016

• Time-dependent deformation behavior of polyvinylidene fluoride binder: Implications on the mechanics of composite electrodes, Vol. 332, 118-128, 2016, Journal of Power Sources. (Co-authors:Arnuparp Santimetaneedol, Rajasekhar Tripuraneni, and Shawn Chester)

• Inelastic shape changes of silicon particles and stress evolution at binder/particle interface in a composite electrode during lithiatoin/delithiation cycling,Vol. 9, 430-438, 2016, Extreme Mechanics Letters. (Co-authors: Hailong Wang, Vivek Shenoy)

• Stress evolution in lithium-ion composite electrodes during electrochemical cycling and resulting internal pressures on the cell casing, Vol. 162(14), A2656-A2663, 2015, Journal of the Electrochemical Society. (Co-authors: Vijay Sethuraman, Daniel Abraham, Allan Bower, and Pradeep Guduru)
• Real-time stress measurements in Ge thin film electrodes during lithiation/delithiation cycling, Vol. 162 (14), A2840- A2846, 2015, Journal of the Electrochemical Society. (Co-authors: Rajasekhar Tripuraneni and Vijay Sethuraman)
  
• Effect of Crack Length and Orientation on the Mixed-Mode Fracture Behavior of Graphene, Vol. 5, 10-17, 2015, Extreme Mechanics Letters. (Co-authors: Dibakar Dutta, Yinfeng Li, Vivek D Shenoy) 

• Structural changes driven by Li flux density in initial lithiation of single crystal silicon, Vol.161, A915-A919, 2014, Journal of The Electrochemical Society.  (Co-authors:  Myeonghun Song, Vijay Sethuraman, P.R. Guduru, M.J. Chon, and L.-Q. Wang) 
• Flame Retardant Co-solvent Incorporation into Lithium-Ion Coin Cells with Thin-film Si Anodes, Vol.161, A176-A182, 2014, Journal of The Electrochemical Society.  (Co-authors: Ronn Dunn, P.R. Guduru, Brett Lucht)
• Measurement and modeling of the mechanical and electrochemical response of amorphous Si thin film electrodes during cyclic lithiation,Vol. 62, 276-294, 2014, Journal of the Mechanics and Physics of Solids. (Co-authors: Giovanna Bucci, Vijay Sethuraman, Allan F. Bower, Pradeep R. Guduru)

• On plastic deformation and fracture in Si films during electrochemical lithiation/delithiation cycling, Vol.160, A1885-A1893, 2013, Journal of The Electrochemical Society. (Co-authors: Vijay Sethuraman and Pradeep R. Guduru)
• Stress evolution in composite  silicon electrodes during lithiation/delithiatoin”, Vol. 160, 4, A739-A746, 2013, Journal of The Electrochemical Society. (Co-authors: Vijay Sethuraman, A. Nguyen, M.J. Chon, H.Wang, D.P.Abraham, A.F. Bower, V.B. Shenoy, P.R. Guduru)

• Quantifying the capacity loss due to Solid-Electrolyte-Interphase layer formation in Li-ion batteries, Vol.215, 145-151, 2012, Journal of Power Sources. (Co-authors: Vijay A Sethuraman, Swapnil Dhalavi, Brett Lucht, Michael Chon, Vivek Shenoy, Pradeep R Guduru)
• Prediction of pad cratering fracture at the copper pad-printed circuit board interface, Vol. 52, 1454-1463, 2012, Microelectronics Reliability.(Co-author: Jan K. Spelt)

• Mixed-mode fracture load prediction of lead free solder joints, Vol. 78, 317-333, 2011, Engineering Fracture Mechanics.(Co-author: Jan K. Spelt)
• Effect of geometry on the fracture behaviour of lead-free solder joints, Vol.78, 1169-1181, 2011, Engineering Fracture Mechanics.(Co-author: Jan K. Spelt)

•  Fracture load prediction of lead free solder joints, Vol. 77, 3446-3461, 2010, Engineering Fracture Mechanics.(Co-author: Jan K. Spelt)
• R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints:Eeffect of mode ratio and microstructure, Vol. 527, 724-734, 2010, Material Science and Engineering A. (Co-author: Jan K. Spelt)

• A Numerical Study of the effect of loading conditions on tubular hydroforming, Vol. 196, 174-183, 2008, Journal of Materials Processing and Technology.(Co-author: R. Narasimhan)
•  An analysis of localized necking in aluminium alloy tubes during hydroforming using a continuum damage model, Vol. 2, 200-209, 2007, International Journal of Mechanical sciences. (Co-authors: R. Narasimhan, Alan Luo, Anil.k.Sachdev)

Invited Presentations (Since May 2014)

• Invited speaker the second International Structural Integrity Conference and Exhibition, Hyderabad, India, 25-27 July 2018.
• Invited speaker at the special seminar in Indian Institute of Technology Madras, Chennai, India 24 July 2018
• Keynote speaker at the joint European Conference on Computational Mechanics and European Conference on Computational Fluid Dynamics held at Glasgow, UK, 11-15 June 2018.
• Seminar speaker at Mechanical Engineering Srping 2018 seminar series at Michigan Technological University, Houghton, MI, 12 April 2018.
• Invited speark at TMS annual meeting at San Diego, 1 March 2017
• Seminar speaker at MSE fall 2014 seminar series at Drexel University, 8 Oct 2014.
•  Invited speaker at symposium in USNCTAM 2014 at Michigan State University
  
•  Invited Speaker at Sustainable Industrial Processing Summit and Exhibition, an international conference honoring Prof Sachtman (Nobel Laureate in Chemistry 2011) at Cancun, Mexico, 29 June -04 July 2014.
• Special Pennergy Seminar, University of Pennsylvania, Philadelhpia 21 February 2014.
• Invited lecture at Indian Institute of Technology, Madras, 13 Jan 2015
• Invited lecture at Indian Institute of Technology, Hyderabad, 12 Jan 2015

• Fracture of 2D crystalline nanomaterials: effect of hydrogen functionalization and complex loading, ASME IMECE 2014, Montreal, Canada, November 14-20, 2014.
• Stresses in composite electrodes and their effect on battery design, SES 51^st Annual Technical Meeting, Purdue University, West Lafayette, Indiana, October 1-3, 2014.
• Electrochemical-mechanical interactions in Lithium-ion batteries, 17^th U.S. National Congress on Theoretical and Applied Mechanics, Michigan State University, June 15- 20, 2014. (invited)
• Role of mechanics in the design of durable lithium-ion batteries, Shechtman International Symposium, Cancun, Mexico, 29 June- 04 July 2014. (invited)
• Stress evolution in high energy density composite cathodes, Gordon Research Conference on Batteries, Ventura, CA, March 9-14, 2014.
• Mechanical characterization of lithiated Si and solid electrolyte interphase, 49^th annual technical meeting of Society of Engineering Science, Atlanta, GA, Oct 9-12, 2012.
• In situ stress measurements in composite lithium-ion-battery electrodes during charge/discharge process. ECS Meet. 2012, Volume MA2012-02, Issue 9, pages 747.
• Why mechanics phenomena are essential for designing energy storage materials, ASME 2011 International Mechanical Engineering Congress & Exposition, Denver, Colorado, USA, November 11-17, 2011.
• Surface analysis of surface films on Si-thin film anodes, 220th ECS meeting and Electrochemical Energy Summit in Boston, Massachusetts, USA, October 9-14, 2011.
• Characterization and prediction of pad-crater failure in lead-free compatible PCBs, SMTA International Conference on Soldering and Reliability, Toronto, ON, May 4-6, 2011.
• A geometry and size independent failure criterion for fracture prediction in lead-free solder joints, SMTA International Conference on Soldering and Reliability, Toronto, ON, May 18-20, 2010.
• Predicting the strength of solder joint using cohesive zone modeling, SMTA International Conference on Soldering and Reliability, Toronto, ON, May 19-22, 2009.
• Fracture behavior of a lead-free solder/Cu joint system, SMTA International Conference on Soldering and Reliability, Toronto, ON, May 13-16, 2008.